IST METZ and ITL present new solutions in the fields of adhesion and encapsulation
Nürtingen, 24th August 2012: At the Bondexpo, which will take place from 8th - 11th October 2012 in Stuttgart, Germany, UV system manufacturer IST METZ GmbH and its partner Integration Technology Ltd. (ITL) will be presenting a wide range of products for curing adhesives using UV technology at Stand 7605-1, Hall 7.
IST METZ and ITL offer a wide range of UV solutions for applications in the fields of electronics, opto-electronics and medical technology, and also for bonding glass, plastics and metal. The companies' adhesion and encapsulation portfolio includes both conventional UV systems and LED units for curing cationic, radical and dual-cure adhesives. From spot bonding to large-area adhesion, these systems can be used to implement a variety of applications.
The wave length and intensity of the UV light used in the systems is designed to suit the specialist demands of adhesives. The UV-lamps demonstrate high performance levels in the wave length range below 300 nm. This prevents the adhesive from reacting with oxygen and ensures that it is cured completely. What is more, the UV technology has several key benefits compared to conventional procedures: it hardens adhesives in a matter of seconds, allowing processing of the material to continue immediately, and also offers high levels of rigidity and resistance.
The BLK®-6 is the latest development from IST METZ in the field of surface bonding. The UV system's innovative technology makes it highly efficient; all BLK®-6 units are fitted with the new UV online sensor as standard. The miniature sensor, directly integrated into the surface of the reflector, measures the UV radiation efficiency online and shows it in the operator display. This allows closer monitoring of the UV lamp's performance, thus guaranteeing high process reliability.
The basic components of the UV system, such as the new URS® inlay reflectors, the UV lamps and the ELC® electronic power supply devices were developed and manufactured in-house at IST METZ. This makes the continuous optimisation process much easier, while also enabling the individual components to work together in a highly effective overall system.
In the future market of LED UV systems, ITL's water-cooled UV system, LEDZero Solidcure™, is the latest development for spot bonding and encapsulation. Its open architecture makes the unit highly flexible, allowing adaptation to suit a wide range of applications. Once switched on, the system is ready straight away. It also transmits very little heat to the substrate and has an extremely long service life.
One of the latest examples of how the LEDZero Solidcure™ can be used is for adhesion in flat-screen devices. IST METZ is also actively working on developing encapsulation technology for printed electronics.
This year's Bondexpo isn't the only place IST METZ is giving an overview of potential industrial applications of UV technology. On 28th and 29th November 2012, the company will be hosting the first Industrial UV Forum at its headquarters in Nürtingen. This event will focus on finishing plastics using UV technology. IST experts, partners from the system manufacturing and chemical industries and well-known users will give talks explaining their own perspectives on the functions and customer benefits of UV technology.
Please find more information about the Industrial UV Forum here.
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